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Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
by Bailey, Christopher | Liu, Johan | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Bradford, England : Emerald Group Publishing, c2006Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available
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Materials for high-density electronic packaging and interconnection [electronic resource] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
by National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available
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Boundary-scan interconnect diagnosis [electronic resource] / Jos�e T. de Sousa, Peter Y.K. Cheung.
by Sousa, Jos�e T. de | Cheung, Peter Y. K | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Boston : Kluwer Academic Publishers, c2001Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available
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Advanced wirebond interconnection technology [electronic resource] / by Shankara K. Prasad.
by Prasad, Shankara K | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Boston : Kluwer Academic Publishers, 2004Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available
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Advanced wirebond interconnection technology [electronic resource] / by Shankara K. Prasad.
by Prasad, Shankara K | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Boston : Kluwer Academic Publishers, 2004Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
by Bailey, Christopher | Liu, Johan | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Bradford, England : Emerald Group Publishing, c2006Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu.
by Wu, Andy [editor.]. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Zurich, Switzerland : TTP, 2014Copyright date: �2014Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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LED packaging for lighting applications [electronic resource] : design, manufacturing, and testing / Sheng Liu, Xiaobing Luo.
by Liu, S. (Sheng), 1963- | Luo, Xiaobing, 1974- | Chemical Industry Press | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Hoboken, N.J. : Wiley, 2011Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Boundary-scan interconnect diagnosis [electronic resource] / Jos�e T. de Sousa, Peter Y.K. Cheung.
by Sousa, Jos�e T. de | Cheung, Peter Y. K | ProQuest (Firm). Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Boston : Kluwer Academic Publishers, c2001Online access: Click to View Availability: Items available for loan: IUKL Library (1).
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Semiconductor packaging [electronic resource] : materials interaction and reliability / Andrea Chen, Randy Hsiao-Yu Lo.
by Chen, Andrea | Lo, Randy | ProQuest (Firm). Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Boca Raton : CRC Press, 2011Online access: Click to View Availability: Items available for loan: IUKL Library (1).
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