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Packaging for nonthermal processing of food [electronic resource] / edited by Jung H. Han.
by Han, Jung H | ebrary, Inc. Edition: 1st ed.Material type:  Book; Format:
electronic
available online
 ; Literary form:
Not fiction
Publisher: Ames, Iowa : Blackwell Pub. : IFT Press, 2007Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available
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Food contact rubbers 2 [electronic resource] : products, migration and regulation / Martin J. Forrest.
by Forrest, Martin J. (Martin John) | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Shawbury, U.K. : Rapra Technology Ltd., 2006Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Regulation of food packaging in Europe and the USA [electronic resource] / Derek J. Knight and Lesley A. Creighton.
by Knight, Derek J | Creighton, Lesley A | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Shawbury, U.K. : Rapra Technology Ltd., 2004Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Additive migration from plastics into foods [electronic resource] : a guide for analytical chemists / T.R. Crompton.
by Crompton, T. R. (Thomas Roy) | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Shawbury, U.K. : Smithers Rapra Technology Ltd., c2007Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Rigid plastics packaging [electronic resource] : materials, processes and applications / F. Hannay.
by Hannay, F | Rapra Technology Limited | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Shrewsbury, U.K. : Rapra Technology, 2002Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Assessing food safety of polymer packaging [electronic resource] / Jean-Maurice Vergnaud, Iosif-Daniel Rosca.
by Vergnaud, J. M | Rosca, Iosif-Daniel | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Shrewsbury, Shropshire : Rapra Technology, 2006Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Advanced wirebond interconnection technology [electronic resource] / by Shankara K. Prasad.
by Prasad, Shankara K | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Boston : Kluwer Academic Publishers, 2004Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Adhesion in microelectronics / edited by K. L. Mittal and Tanweer Ahsan.
by Mittal, K. L, 1945- [editor.] | Ahsan, Tanweer [editor.]. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014Copyright date: �2014Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Food contact materials [electronic resource] : rubbers, silicones, coatings and inks / Martin Forrest.
by Forrest, Martin J. (Martin John) | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Shawbury : iSmithers, c2009Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Lead-free solder interconnect reliability [electronic resource] / edited by Dongkai Shangguan.
by Shangguan, Dongkai, 1963- | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Materials Park, OH : ASM International, 2005Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Handbook of paper and paperboard packaging technology [electronic resource] / edited by Mark J. Kirwan.
by Kirwan, Mark J | ebrary, Inc. Edition: 2nd ed.Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Chichester, West Sussex ; Ames, Iowa : Wiley-Blackwell, 2013Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Lead-free solder interconnect reliability [electronic resource] / edited by Dongkai Shangguan.
by Shangguan, Dongkai, 1963- | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Materials Park, OH : ASM International, 2005Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
by Bailey, Christopher | Liu, Johan | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Bradford, England : Emerald Group Publishing, c2006Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Research on food packaging technology : selected, peer reviewed papers from the 2013 China Academic Conference on Food Packaging, November 23-25, 2013, Tianjin, China / edited by Ouyang Yun [and three others].
by China Academic Conference on Food Packaging (2013 : Tianjin, China) | Yun, Ouyang. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Durnten-Zurich : Trans Tech Publications, [2014]Copyright date: �2014Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Green printing and packaging materials : selected, peer-reviewed papers from the 2011 China Academic Conference on Green Printing and Packaging Materials, August 20-23, 2011, Harbin China / edited by Ouyang Yun, Xui Min and Yang Li.
by China Academic Conference on Green Printing and Packaging Materials (2011 : Harbin, China) | Yun, Ouyang | Min, Xui | Li, Yang. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Zurich, Switzerland : Trans Tech Publications, 2012Copyright date: �2012Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu.
by Liu, S. (Sheng), 1963- | Liu, Yong, 1962- | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Hoboken, N.J. : Wiley, 2011Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu.
by Liu, S. (Sheng), 1963- | Liu, Yong, 1962- | ebrary, Inc. Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Hoboken, N.J. : Wiley, 2011Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Food biochemistry and food processing [electronic resource].
by Simpson, Benjamin K | ebrary, Inc. Edition: 2nd ed. / edited by Benjamin K. Simpson ... [et al.].Material type: Book; Format:
electronic
available online
; Literary form:
Not fiction
Publisher: Ames, Iowa : Wiley-Blackwell, 2012Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu.
by Wu, Andy [editor.]. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Zurich, Switzerland : TTP, 2014Copyright date: �2014Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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Microwave and millimeter-wave electronic packaging / Rick Sturdivant.
by Sturdivant, Rick [author.]. Material type: Book; Format:
available online
; Literary form:
Not fiction
Publisher: Boston, [Massachusetts] ; London, [England] : Artech House, 2014Copyright date: �2014Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1).
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