IUKL Library catalog › Results of search for 'su:"Packaging"'

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		Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser, Ph. D. and Steffen Kr�ohnert. by Keser, Beth [editor.] \| Kroehnert, Steffen [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, NJ : Wiley, 2019Online access: Click to View Availability: Items available for loan: IUKL Library (1). Place hold Log in to add tags. Add to cart (remove)
		IMAPS-CPMT 2014 Poland. by Skwarek, Agata \| Goosey, Martin. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Bradford, West Yorkshire : Emerald Publishing Limited, 2015Copyright date: �2015Online access: Click to View Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)

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