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Results of search for 'su:"Electronic packaging"'

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		No cover image available Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu. by Bailey, Christopher \| Liu, Johan \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Bradford, England : Emerald Group Publishing, c2006Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available Log in to add tags. Add to cart (remove)
		No cover image available Materials for high-density electronic packaging and interconnection [electronic resource] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. by National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available Add to cart (remove)
		No cover image available Boundary-scan interconnect diagnosis [electronic resource] / Jos�e T. de Sousa, Peter Y.K. Cheung. by Sousa, Jos�e T. de \| Cheung, Peter Y. K \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Boston : Kluwer Academic Publishers, c2001Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available Add to cart (remove)
		No cover image available Advanced wirebond interconnection technology [electronic resource] / by Shankara K. Prasad. by Prasad, Shankara K \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Boston : Kluwer Academic Publishers, 2004Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available Add to cart (remove)
		No cover image available Advanced wirebond interconnection technology [electronic resource] / by Shankara K. Prasad. by Prasad, Shankara K \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Boston : Kluwer Academic Publishers, 2004Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		No cover image available Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu. by Bailey, Christopher \| Liu, Johan \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Bradford, England : Emerald Group Publishing, c2006Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu. by Wu, Andy [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Zurich, Switzerland : TTP, 2014Copyright date: �2014Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		No cover image available LED packaging for lighting applications [electronic resource] : design, manufacturing, and testing / Sheng Liu, Xiaobing Luo. by Liu, S. (Sheng), 1963- \| Luo, Xiaobing, 1974- \| Chemical Industry Press \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Hoboken, N.J. : Wiley, 2011Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		No cover image available Boundary-scan interconnect diagnosis [electronic resource] / Jos�e T. de Sousa, Peter Y.K. Cheung. by Sousa, Jos�e T. de \| Cheung, Peter Y. K \| ProQuest (Firm). Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Boston : Kluwer Academic Publishers, c2001Online access: Click to View Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		No cover image available Semiconductor packaging [electronic resource] : materials interaction and reliability / Andrea Chen, Randy Hsiao-Yu Lo. by Chen, Andrea \| Lo, Randy \| ProQuest (Firm). Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Boca Raton : CRC Press, 2011Online access: Click to View Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)

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