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Results of search for 'su:"Microelectronic packaging"'

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		No cover image available Optoelectronic packaging. by Basavanhally, Y. C. Lee \| Mickelson, Alan Roff \| Lee, Yung-Cheng. Material type: Book Publisher: New York : John Wiley & Sons, 1977Availability: Items available for loan: IUKL Library [Call number: TA1750 Bas] (1). Place hold Log in to add tags. Add to cart (remove)
		No cover image available Lead-free solder interconnect reliability [electronic resource] / edited by Dongkai Shangguan. by Shangguan, Dongkai, 1963- \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Materials Park, OH : ASM International, 2005Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available Add to cart (remove)
		No cover image available Area array packaging handbook [electronic resource] / Ken Gilleo. by Gilleo, Ken \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: New York : McGraw-Hill, 2002Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available Add to cart (remove)
		No cover image available Microvias [electronic resource] : for low cost, high density interconnects / John H. Lau, S.W. Ricky Lee. by Lau, John H \| Lee, S. W. Ricky \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: New York : McGraw-Hill, 2001Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available Add to cart (remove)
		Adhesion in microelectronics / edited by K. L. Mittal and Tanweer Ahsan. by Mittal, K. L, 1945- [editor.] \| Ahsan, Tanweer [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014Copyright date: �2014Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Lists: 20220421 MQA FEST Bachelor of Electronics Engineering with Honours . Place hold Add to cart (remove)
		No cover image available Lead-free solder interconnect reliability [electronic resource] / edited by Dongkai Shangguan. by Shangguan, Dongkai, 1963- \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Materials Park, OH : ASM International, 2005Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		No cover image available Lead-free solder interconnect reliability [electronic resource] / edited by Dongkai Shangguan. by Shangguan, Dongkai, 1963- \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Materials Park, OH : ASM International, 2005Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		No cover image available Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu. by Liu, S. (Sheng), 1963- \| Liu, Yong, 1962- \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Hoboken, N.J. : Wiley, 2011Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		No cover image available Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu. by Liu, S. (Sheng), 1963- \| Liu, Yong, 1962- \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Hoboken, N.J. : Wiley, 2011Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu. by Wu, Andy [editor.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Zurich, Switzerland : TTP, 2014Copyright date: �2014Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		Microwave and millimeter-wave electronic packaging / Rick Sturdivant. by Sturdivant, Rick [author.]. Material type: Book; Format: available online ; Literary form: Not fiction Publisher: Boston, [Massachusetts] ; London, [England] : Artech House, 2014Copyright date: �2014Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		No cover image available Portable consumer electronics [electronic resource] : packaging, materials, and reliability / Sridhar Canumalla, Puligandla Viswanadham. by Canumalla, Sridhar \| Viswanadham, Puligandla \| ebrary, Inc. Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Tulsa, Okla. : PennWell, c2010Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		No cover image available LCP for microwave packages and modules [electronic resource] / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara. by Pham, Anh-Vu H \| Chen, Morgan J \| Aihara, Kunia \| ProQuest (Firm). Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Cambridge ; New York : Cambridge University Press, 2012Other title: Liquid crystal polymer for microwave packages and modules.Online access: Click to View Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)
		No cover image available Portable consumer electronics [electronic resource] : packaging, materials, and reliability / Sridhar Canumalla, Puligandla Viswanadham. by Canumalla, Sridhar \| Viswanadham, Puligandla \| ProQuest (Firm). Material type: Book; Format: electronic available online ; Literary form: Not fiction Publisher: Tulsa, Okla. : PennWell, c2010Online access: Click to View Availability: Items available for loan: IUKL Library (1). Place hold Add to cart (remove)

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