000			01570nam a2200349Ia 4500
001			ebr10320380
003			CaPaEBR
007			cr cn|||||||||
008			070206s2006 ohua sb 101 0 eng d
010			_z 2007271628
020			_z9780871708458
020			_z0871708450
040			_aCaPaEBR _cCaPaEBR
035			_a(OCoLC)647829214
050	1	4	_aR857.M3 _bM38 2005eb
111	2		_aMaterials & Processes for Medical Devices Conference _n(3rd : _d2005 : _cBoston, Mass.)
245	1	0	_aMedical device materials III _h[electronic resource] : _bproceedings from the Materials & Processes for Medical Devices Conference 2005, November 14-16, 2005, Boston, Massachusetts, USA / _cedited by Ramakrishna Venugopalan, Ming Wu ; sponsored by ASM International.
260			_aMaterials Park, OH : _bASM International, _cc2006.
300			_aix, 250 p. : _bill.
500			_a"SAN 204-7586"--T.p. verso.
504			_aIncludes bibliographical references and author index.
533			_aElectronic reproduction. _bPalo Alto, Calif. : _cebrary, _d2009. _nAvailable via World Wide Web. _nAccess may be limited to ebrary affiliated libraries.
650		0	_aBiomedical materials _vCongresses.
650		0	_aBiomedical engineering _vCongresses.
655		7	_aElectronic books. _2local
700	1		_aVenugopalan, Ramakrishna.
700	1		_aWu, Ming Hsiung.
710	2		_aebrary, Inc.
856	4	0	_uhttp://site.ebrary.com/lib/kliuc/Doc?id=10320380 _zAn electronic book accessible through the World Wide Web; click to view
942			_2lcc _cEBK
999			_c147640 _d147640